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The application group hard materials consists of cemented carbides, ceramics, cermets, PCD, PCB (CBN), hard material layers and other hard materials.
Essential for the machining is the use of diamond as abrasive. WENDT grinding tools for the machining of hard materials comprise the complete range of international used shapes and geometries.
The tools are mainly used in the following bonding systems:
Resin Bond
Uncomplicate grinding operations with good material removal rates are typical for resin bonds. The mechanical and thermal influence on the workpiece is very low. A wide range of special adapted bonds are available
- for periphery and top & bottom grinding of indexable inserts, grooving tools and wear parts
- for CNC tool grinding of TC drills and cutters
- for cutting and OD grinding of TC rods
- for flat grinding of wear plates
Sintered Metal Bond
These extremely wear resistant and profile consistent bonds are used for
- profile grinding operations
- crushing (profiling method)
- periphery grinding of indexable inserts (special open bonds)
- grinding of flutes in TC drills and cutters (special bonds in sonor-line)
- grinding of polycrystalline materials like PCD and PCB (CBN) with soft bonds (see below)
Vitrified Bond
The advantage of the vitrified bond is the excellent cutting ability and profile ability combined with good wear and profile resistance. The fine vitrified bonding structure is specially suitable for wheels with micro grit diamond. Vitrified diamond grinding wheels are increasingly used for
- grinding of polycrystalline materials like PCD and PCB (CBN) (see above)
- profile grinding of TC threading plates (including crushing)
- OD grinding of paper rolls, shafts and rods
- flat grinding of ceramic components
Electroplated (Galvanic) Bond
Electroplated grinding tools stand out due to extraordinary good cutting ability. Balancing the low life time which is caused by the single diamond layer, the tools can be replated several times. Main applications are:
- grinding of slots in hard materials
- various profile grinding operations
- cutting of ceramic parts (e.g. catalysts)
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